Modeling and extraction of residual stresses in some MEMS multilayer systems

Modeling and extraction of residual stresses in some MEMS multilayer systems
Li Long, Frank Long, Bernhard Schwartz, Geert Brokmann, and Thomas Ortlepp
J. Sens. Sens. Syst., 15, 167–175, https://doi.org/10.5194/jsss-15-167-2026, 2026
Thin-film multilayers deposited on a wafer induce bending due to residual and thermal stresses that strongly depend on process conditions. The resulting curvature can be measured optically. We present a closed-form analytical model that relates the measured curvature to the residual stresses in individual layers. Using a small set of curvature measurements, layer-resolved residual stresses can be extracted without resource-intensive finite-element model simulations.

Source: https://doi.org/10.5194/jsss-15-167-2026